Critical Materials & Supply Chain▲
Xiamen Tungsten Completes Issuance of 500 Million Yuan Technology Innovation Bond at 1.65% Coupon
Xiamen Tungsten announced that the company has completed the issuance of its first tranche of technology innovation bonds for 2026, with an actual total issuance of 500 million yuan. The bond, abbreviated as 26 Xiamen Tungsten MTN001 (Technology Innovation Bond), has a term of three years, with an interest accrual date of September 18, 2026, and a redemption date of September 18, 2029. The coupon rate is 1.65%, and the issue price is 100 yuan per 100 yuan of face value. Industrial Bank served as the lead underwriter for this bond, with GF Securities as the joint lead underwriter. The raised funds have recently been received.
About megatrends
Critical Materials & Supply Chain › Rare Earths & Permanent Magnets Capital
600549.CG · Capital · Positive Xiamen Tungsten completed a 500 million yuan technology innovation bond issuance at a low 1.65% coupon, securing financing.