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Shenzhen Edadoc Technology Co. Ltd. A

Shenzhen Edadoc Technology Co., Ltd. provides printed circuit board (PCB) design and PCB assembly manufacturing services in China and internationally. Its offerings include simulation analysis services such as DDRx simulation, high-speed serial interface, power integrity simulation, system-in-package design, universal standard fixtures, customized fixtures, and laboratory services, as well as PCB fabrication and component selection services. The company was founded in 2003 and is headquartered in Shenzhen, China.

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Sidike plans 1.652 billion yuan investment in high-end BOPET base film expansion; Xingyun Technology subsidiary signs 872 million yuan intelligent computing lease contract

Sidike announced that it plans to have its wholly owned subsidiary Jiangsu Xingyuantai New Material Technology implement an expansion project with annual output of 103,000 tonnes of high-end functional BOPET base film, with total estimated investment of 1.652 billion yuan, funded by self-owned and self-raised capital, located in Sihong, Jiangsu, for large-scale production of MLCC release film base film, polarizer release and protective film base film, and other high-end functional BOPET substrate products. Xingyun Technology's wholly owned subsidiary Changsha Xiangshuyun Technology signed an intelligent computing resource leasing service contract with a VE customer for a service term of five years, with a tax-inclusive total amount of 872 million yuan; revenue will be recognised in stages, and delivery is expected to be completed before 30 September 2026. Hangyang Co plans to invest 50 million yuan in Shanghai Xinghuan Jueneng Technology, obtaining a 0.66% equity stake, thereby substantively participating in the controllable nuclear fusion field. Yibo Technology's wholly owned subsidiary Zhuhai Yibo Electronics plans to add investment in the second-phase PCB factory construction project, with total new investment not exceeding 800 million yuan, focusing on medium-to-large-volume production of mid-to-high-end PCB products. In addition, Jianghe Group's wholly owned subsidiary won the bid for a 318 million yuan high-end apartment curtain wall project, and Huanlejia preliminarily set the inquiry transfer price at 13.30 yuan per share.
About megatrends
Semiconductors › Passive Components (MLCC, Capacitors, Inductors) ▲Supply
Semiconductors › Printed Circuit Boards (PCB & HDI) ▲Supply
Artificial Intelligence › AI Compute Cloud & Neoclouds ▲Demand
Fusion Energy › Fusion Pure-plays (Developers) Capital
300806.CS · Capital · Positive Sidike plans a 1.652 billion yuan expansion of high-end functional BOPET base film capacity via its subsidiary.
Changsha Xiangshuyun Technology Co., Ltd. · Demand · Positive Xingyun Technology's subsidiary signed an 872 million yuan five-year intelligent computing resource leasing contract with a VE customer.
Jiangsu Xingyuantai New Materials Technology Co., Ltd. · Capital · Positive Sidike's wholly owned subsidiary Jiangsu Xingyuantai New Material will implement a 1.652 billion yuan expansion of high-end BOPET base film capacity.
002430.CS · Capital · Positive Hangyang plans to invest 50 million yuan for a 0.66% stake in Shanghai Xinghuan Jueneng, entering the controllable nuclear fusion field.
301366.CS · Capital · Positive Yibo Technology's subsidiary plans up to 800 million yuan additional investment in its second-phase PCB factory.
300997.CS · Capital · Neutral Huanlejia preliminarily set its inquiry transfer price at 13.30 yuan per share, a valuation/share-transfer event.
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