ROHM Co., Ltd. manufactures and sells electronic components worldwide. It operates through LSI, semiconductor element, module, and other segments. The company offers a wide range of products including ICs, discrete semiconductors, power devices, modules, and opto devices, as well as foundry services. Its products serve industry, automotive, consumer electronics, and telecommunications applications. ROHM was incorporated in 1940 and is headquartered in Kyoto, Japan.
Rohm, Toshiba, Mitsubishi Electric power semiconductor integration talks stall, falling behind 'summer' target for agreement
Talks among Rohm, Toshiba and Mitsubishi Electric on integrating their power semiconductor businesses are struggling, and a certain agreement that had initially been targeted for around the summer is now delayed. The talks began in March, and for now the three aim to reach an agreement by their November interim earnings announcements, but if they clash over the form of the integration and other issues, it could slip to March next year. The three companies envision a business integration centered on a holding company structure, under which would sit a business entity into which their power semiconductor divisions would be transferred and another entity carved out of the analog semiconductor and sensor operations held by Rohm and Toshiba. However, the equity stakes in the new company remain unclear amid a struggle for leadership, and details such as the scope of the businesses to be separated have yet to be worked out. Responding to the surge in global semiconductor demand driven by the artificial intelligence boom, and the time needed to obtain antitrust approval from Chinese authorities, are also contributing to the delay in the talks. Japanese players are a notable presence in the global power semiconductor market, but with many companies crowding the field, each one's scale is small, and if the three companies' integration is realized, they would leap to become the world's second-largest power semiconductor maker.
Semiconductors › Analog, Power & Discrete Competition
Electrification & Mobility › EV Power Semiconductors (SiC / IGBT) Competition
6503.JP · Capital · Negative Mitsubishi Electric's power semiconductor business integration talks with Rohm and Toshiba have stalled, delaying the planned holding-company deal.
6963.JP · Capital · Negative Rohm's power semiconductor integration talks with Toshiba and Mitsubishi Electric are delayed amid unresolved equity stakes and leadership disputes.
ROHM Launches 100V Automotive MOSFET With Five Times the SOA Tolerance
ROHM Co., Ltd. has developed the RS4P063BPHZG, a 100V MOSFET optimized for automotive safety functions and protection circuits. The new product achieves a Wide-SOA, or Safe Operating Area, across a broad voltage range in the standard HPLF5060, or 5060-size, package widely used in automotive applications. By incorporating a design that effectively suppresses secondary breakdown, it delivers approximately five times the SOA tolerance of standard equivalent-sized products under VDS=100V and PW=100 microseconds. Adopting the standard 5060-size package also simplifies replacement evaluation with existing layouts, helping reduce the workload and costs associated with design changes. The device targets applications subject to momentary high-power loads, including airbag inflator ignition circuits, seat belt pretensioner drive circuits, and pyro-fuse drive circuits for battery cutoff. ROHM said it is also developing automotive Wide-SOA MOSFETs in the HPLF8080, or 8.0 x 8.0 mm, and TOLG, or TO-Leaded with Gullwing, 9.9 x 11.7 mm, packages.
Semiconductors › Analog, Power & Discrete Technology
6963.JP · Technology · Positive ROHM launched a new 100V automotive Wide-SOA MOSFET with ~5x SOA tolerance for safety/protection circuits, a product/R&D development.
ROHM Introduces 650V IGBTs with Industry-Leading Low Loss
ROHM Semiconductor has developed 4th Generation 650V IGBTs for automotive electric compressors, HV heaters, and industrial equipment inverters. The new automotive-grade devices achieve class-leading low conduction loss with VCE(sat) of 1.55V, provide 7 microseconds short-circuit withstand time at 25 degrees Celsius junction temperature, and comply with the AEC-Q101 automotive reliability standard. The lineup includes 12 products in the TO-247N package and 10 bare wafer products, with 12 additional TO-247-4L package products under development. ROHM plans to further expand the lineup with compact surface-mount IGBTs using TO-263L and top-side cooling packages.
ROHM Semiconductor has developed a new evaluation board, the BD83070GWL-EVK-002, designed to showcase its BD83070GWL buck-boost DC-DC converter IC. The board achieves an ultra-compact mounting area of 12.87 square millimeters, integrating the IC with a coil, capacitors, and a total of only five components. The BD83070GWL IC itself delivers up to 97% efficiency and an ultra-low quiescent current of 2.8 microamps, targeting small battery-powered devices such as wearables, mobile devices, and IoT products. As a reference design, circuit patterns and the bill of materials are publicly available to ease the transition from evaluation to mass production. The board is now available for purchase through online distributors including DigiKey and Farnell.
6963.JP · Technology · Positive ROHM launched a new ultra-compact buck-boost DC-DC evaluation board with high efficiency and low quiescent current, targeting wearables and IoT.
Mitsubishi Electric, Toshiba, and Rohm Target September Deal to Combine Power-Chip Businesses
Mitsubishi Electric, Toshiba, and Rohm are aiming to reach an agreement by September to combine their power-chip businesses into a joint venture that would integrate sales, manufacturing, and development, with Mitsubishi Electric tentatively expected to lead the merged entity. Mitsubishi Electric CEO Kei Uruma said the companies are working through final terms and hope to announce plans by September, believing the deal could strengthen their ability to compete with major global rivals and possibly reach the top position in power-semiconductor market share. Each of the three companies currently holds less than 5% of the global power-semiconductor market, while Infineon Technologies controls nearly one-fifth, according to Omdia. The companies still need to resolve disagreements over the product scope, as Toshiba and Rohm want to include analog chips such as converters and drivers, while Mitsubishi Electric prefers a tighter focus on power chips. Uruma also noted that Japan's government subsidy rules require at least 200 billion yen, or about $1.2 billion, in investments involving other companies to qualify for support, a requirement he called too demanding, and warned that without similar assistance the combined venture's costs could remain higher than those of overseas competitors.
ROHM Launches 600V Super Junction MOSFETs in Surface-Mount Packages
ROHM Semiconductor has developed new 600V Super Junction MOSFET series, the R60xxXNx and R60xxWNx, now available in surface-mount DFN8080-5L and TOLL packages. The lineup includes 21 high-speed switching models and 11 PrestoMOS models with class-leading high-speed recovery characteristics, targeting power supplies for AI servers and industrial equipment. The gate threshold voltage is set to a 3V to 5V range for broad compatibility, while improved admittance characteristics reduce loss compared to previous series. Mass production began in June 2026, with TOLL package products already available through online distributors like DigiKey.
ROHM Launches AG16xFNxx Series MOSFETs for Automotive 48V Power Supply Systems
ROHM Semiconductor has developed the AG16xFNxx Series, a lineup of 80V power MOSFETs for automotive 48V power supply systems. The new products adopt the HPLF5060 and DFN3333 packages, enabling downsizing compared to standard automotive MOSFET packages such as the TO-252. The HPLF5060 features Gull-Wing Leads and the DFN3333 features Wettable Flank Technology, while Copper Clip Junction Technology enhances heat dissipation for high-current handling. All models comply with AEC-Q101, and mass production began in April 2026 for the AG160FNS4FRA and AG166FNH7FRA, with online sales available through distributors like DigiKey and Farnell. ROHM plans to further expand the lineup and has started development of TOLG packaged products.
Electrification & Mobility › EV Power Semiconductors (SiC / IGBT) Technology
Semiconductors › Analog, Power & Discrete Competition
6963.JP · Technology · Positive ROHM launched new MOSFET series for automotive 48V systems, with advanced packaging and heat dissipation, expanding product lineup.
Japan
China