Tianshui Huatian Technology Co., Ltd. researches, develops, produces, packages, tests, and sells semiconductor integrated circuits in China and internationally. Its integrated circuit packaging products include series such as DIP, SOT, SOP, QFP, QFN/DFN, BGA/LGA, FC, MCM, SiP, WLP, TSV, Bumping, MEMS, FO, PLP, and 2.5D/3D. These products are used in electronic assemblies and intelligent fields including computers, network communications, consumer electronics and smart mobile terminals, the Internet of Things, industrial automation control, and automotive electronics. The company also engages in engineering and electromechanical activities, import and export trade, and investment activities, and it exports its products. Founded in 2003, it is headquartered in Tianshui, China.