TOPPAN Holdings Inc.

SBI XDC Network APAC, TOPPAN, and Ginco are advancing a proof-of-concept to streamline trade finance operations—from corporate verification to factoring and payment collection—on the blockchain for overseas transactions of used auto parts and used car exporters in Osaka Prefecture. This project has been adopted under Osaka Prefecture's fiscal 2026 "Osaka Prefecture Pioneering Financial Market Formation Support Subsidy," with SBI XDC Network APAC as the project lead, TOPPAN as a co-participant, and Ginco as a supporting partner. In the demonstration, they will build a business system that verifies the corporate information of exporters and importers using vLEI, and records trade transaction information and factoring transaction information on the blockchain "XDC Network." Furthermore, in the future, they aim to incorporate settlement via stablecoins and tokenization of accounts receivable.

The global flexible packaging market is projected to grow from an estimated $242 billion in 2025 to $320.57 billion by 2031, at a compound annual growth rate of 4.8 percent, according to a new report from ResearchAndMarkets.com. The bags and sacks segment currently leads with a 43 percent market share, while flexible paper is expected to grow at a CAGR of 4.73 percent. The Asia-Pacific region holds a 38 percent market share, driven by packaged food demand and e-commerce growth. Key industry developments include Amcor's merger with Berry Global in April 2025 and TOPPAN's $1.8 billion acquisition of Sonoco's Thermoformed & Flexibles Packaging business. Sustainability trends and shelf-life extension demands are driving adoption, though raw material price volatility remains a restraint.