Tamura Corporation

Tamura Corporation revised upward its consolidated earnings forecast for the fiscal year ending March 2027 on the 27th. Demand for AI data center-related products remains strong, and the recovery in demand for industrial equipment and price revisions for electronic chemical mounting-related products also contributed, with both sales and profit expected to exceed the initial forecast. Operating profit is expected to increase 22.9% from the previous fiscal year to 6.5 billion yen, significantly surpassing the previous record of 5.4 billion yen set in the fiscal year ended March 2018, compared with the previous forecast of 5.6 billion yen. Net profit was also revised to 5.2 billion yen (compared with the previous forecast of 4.5 billion yen and a loss of 1.3 billion yen in the previous fiscal year).

The global semiconductor alloy solder powder market is projected to grow from $0.91 billion in 2026 to $1.2 billion by 2030, at a compound annual growth rate of 7%, according to a new report from ResearchAndMarkets.com. The market expanded from $0.86 billion in 2025 to $0.91 billion in 2026, a 6.8% increase, driven by semiconductor manufacturing expansion, rising consumer electronics demand, and advancements in electronic packaging. Growth is further fueled by electric vehicle electronics, miniaturized components, and high-performance computing, with key trends including lead-free solder powders and fine particle size powders for advanced packaging. North America led the market in 2025, while Asia-Pacific is expected to be the fastest-growing region. Major players include Henkel AG & Co. KGaA, DOWA Holdings Co. Ltd., Tamura Corporation, and Indium Corporation of America, which recently introduced SiPaste C312HF for system-in-package applications and acquired SAFI-Tech to enhance its nanosilver sintering technology.